Research and Markets: Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology, Products & Applications

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/16527e5a/threedimensional) has announced the addition of the "Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, Led" report to their offering.

3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense) The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.

Improved performance, reduced timing, and form factor motivation serve as key drivers for adoption of 3D IC and TSV interconnect solutions. On the other hand, thermal and testing issues and high cost involved largely restrain the growth of the market. In terms of revenue generation, Asia is observed to hold the highest share of around 40%, followed by North America with 35%.

Amongst the different end-products that utilize 3D ICs and TSV interconnects, memories and sensors are expected to provide the largest market owing to improvements in design that can be achieved and the growing demand for such enhanced designs in a wide variety of applications. With respect to the application sectors, consumer electronics sector largely contributes to the overall growth of the market. In the near future, it is expected that newer applications such as hybrid memory, graphics processor unit, low density parity check decoder, and cell broadband engine will emerge and serve as potential markets for 3D ICs and TSV interconnects.

Key Topics Covered: 1 Introduction 2 Executive Summary 3 Market Overview 4 3D Ic Market Classification 5 Product Market 6 Application Market 7 Geographic Analysis 8 Competitive Landscape 9 Company Profiles Companies Mentioned . Amkor Technology . Elpida Memory Inc - Ibm Corp - Intel Corporation - Micron Technology Inc - Monolithic D Inc - Nec Electronics Corporation - Qualcomm Incorporated - Renesas Electronics Corporation - Samsung Electronics Co Ltd - Sony - Statschip Pac - St Microelectronics - Taiwan Semiconductor Manufacturing Company Limited - Texas Instruments Incorporated - Tezzaron Semiconductor - Toshiba Corporation - United Microelectronics Corporation - Xilinx Incorporated - Ziptronix, Inc For more information visit http://www.researchandmarkets.com/research/16527e5a/threedimensional CONTACT: Research and Markets, Laura Wood, Senior Manager.

press@researchandmarkets.com Fax from USA: 646-607-1907 Fax from rest of the world: 353-1-481-1716 Sector: Advanced Technology (http://www.researchandmarkets.com/categories.asp?cat_id=31&campaign_id=16527e5a), Semiconductor (http://www.researchandmarkets.com/categories.asp?cat_id=102&campaign_id=16527e5a) ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to info@m2.com)).

(c) 2012 M2 COMMUNICATIONS

[ Back To Contact Center Solutions Homepage's Homepage ]

Related Contact Center Solutions Articles

MetricNet Publishes 4 New Australian Benchmarks for IT Support, Contact Centres
[ Read More ]
05/21/2013

Liverpool Bosch Contact Center Hopes for Threefold Expansion by Year End
[ Read More ]
05/03/2013

Bunchball Unveils Augmented Gamification Tools for Jive Platform
[ Read More ]
04/08/2013

Teleperformance Earns the Multimedia Contact Center Award
[ Read More ]
03/19/2013

Shangri-La Unveils Customer Contact Center in China
[ Read More ]
03/13/2013

B. Braun Uses NextiraOne for UC and Contact Center Support
[ Read More ]
03/12/2013

Contact Centre Australia Generates Job Growth in Wellington, New Zealand
[ Read More ]
03/04/2013

[ View all Contact Center Solutions Articles ]

Contact Center Solutions Glossary of Terms

A B C D E F G H I J K L M N O

Featured Whitepaper

Microsoft® Lync® in the Contact Center: Integrating with Customer Interaction Center™ to Provide a Barrierâ€free Customer Experience To implement contact center functionality, organizations using Microsoft Lync Server 2010 can follow the unified communications blueprint of open standards interoperability and integrate to a contact center solution of their choice. Customer Interaction Center (CIC) from Interactive Intelligence is a proven best of breed contact center solution that merits consideration ...

Featured Success Story

Interactive Intelligence all-in-one IP communications software suite integrated with Microsoft Lync helps Bentley save $200,000 annually.

Featured Product Demo

Contact Center Solutions Interaction Analyzer™

Interaction Analyzer™
Real-time word and phrase spotting. Alerting. Analytics. Scoring. Coaching. Watch how Interaction Analyzer turns every moment, of every past and present call, into data that lets you deliver an exceptional customer experience.